| Series | - |
| Package | Bulk |
| Part Status | Active |
| Type | SIP |
| Number of Positions or Pins (Grid) | 20 (1 x 20) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | Flash |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 196.9µin (5.00µm) |
| Contact Material - Post | Brass |
| Housing Material | Thermoplastic, Polyester |
| Operating Temperature | -55°C ~ 125°C |
