| Series | - |
| Package | Tray |
| Part Status | Active |
| Type | LGA |
| Number of Positions or Pins (Grid) | 2011 (47 x 58) |
| Pitch - Mating | - |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
| Contact Material - Mating | Copper Alloy |
| Mounting Type | Surface Mount |
| Features | Open Frame |
| Termination | Solder |
| Pitch - Post | - |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 30.0µin (0.76µm) |
| Contact Material - Post | Copper Alloy |
| Housing Material | Thermoplastic |
| Operating Temperature | - |
