SeriesICE Tower
PackageBulk
Part StatusActive
TypeBoard Level
Package CooledRaspberry Pi 3B, 3B+, 4B
Attachment MethodBolt On and Thermal Tape, Adhesive (Included)
ShapeRectangular
Length-
Width-
Diameter-
Fin Height-
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow-
Thermal Resistance @ Natural-
Material-
Material Finish-

RELATED PRODUCT

SKV808012-CU
COPPER HEATSINK 80X80X12MM
TXBE032031B
HEATSINK PRESS ON BLACK TO-5
TXBE032031ND
THERMAL LINK PRESSON NKL TO-5
40143
BOM, ASSEMBLY, 3623 LF PUSH PI
40484
BOM ASSY 6123 XF PUSH PIN HTSN
40140
BOM, ASSEMBLY, 4623 XF PUSH PI
2-1542007-3
HEAT SINK BGA 29MM 3FIN RADIAL
301N
HEATSINK COMPACT