BDN13-3CB/A01

SeriesBDN
PackageBox
Part StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Included)
ShapeSquare, Pin Fins
Length1.310" (33.27mm)
Width1.310" (33.27mm)
Diameter-
Fin Height0.355" (9.02mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow6.00°C/W @ 400 LFM
Thermal Resistance @ Natural16.10°C/W
MaterialAluminum
Material FinishBlack Anodized

RELATED PRODUCT

110991329
HEAT SINK KIT FOR RASPBERRY PI 4
567-45AB
1/8 BRICK HEATSINK 55X20.7X11.4M
529701B02500G
HEATSINK TO-218 SOLDER PIN
529802B00000G
HEATSINK TO-220 10W H=1.5" BLK
SA000-12016
PUSHPIN HEATSINK 31X31X10MM
VM1-038-1AE
HEATSINK VERTICAL
567-94AB
1/8 BRICK HEATSINK 57.9X55X23.9M