Series | - |
Package | Bulk |
Part Status | Active |
Type | Top Mount |
Package Cooled | TO-263 (D²Pak) |
Attachment Method | SMD Pad |
Shape | Rectangular, Fins |
Length | 0.763" (19.38mm) |
Width | 1.000" (25.40mm) |
Diameter | - |
Fin Height | 0.450" (11.43mm) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 23.00°C/W @ 300 LFM |
Thermal Resistance @ Natural | 11.00°C/W |
Material | Copper |
Material Finish | Tin |
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