APF19-19-06CB

SeriesAPF
PackageBox
Part StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Not Included)
ShapeSquare, Fins
Length0.748" (19.00mm)
Width0.748" (19.00mm)
Diameter-
Fin Height0.250" (6.35mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow7.10°C/W @ 200 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlack Anodized

RELATED PRODUCT

693-25
HEATSINK TO220 W/CLIP 25MM
BDN16-3CB/A01
HEATSINK CPU W/ADHESIVE 1.61"SQ
960-21-21-D-AB-0
HEATSINK 21X21MM DIA PUSH PIN
960-21-23-D-AB-0
HEATSINK 21X23MM DIA PUSH PIN
901-19-2-23-2-B-0
HEATSINK 19X19X23MM PIN
901-19-1-23-2-B-0
HEATSINK 19X19X23MM ELLIPTICAL
C264-030-1VE
HEATSINK AND CLIP FOR TO-264