APF40-40-06CB

SeriesAPF
PackageBox
Part StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Not Included)
ShapeSquare, Fins
Length1.575" (40.00mm)
Width1.575" (40.00mm)
Diameter-
Fin Height0.250" (6.35mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow3.30°C/W @ 200 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlack Anodized

RELATED PRODUCT

904-27-2-23-2-B-0
HEATSINK 27X27X23MM PIN
6223BG
BRIDGE RECTIFIER HEATSINK 0.163"
ATS-01F-138-C2-R0
HEATSINK 25X25X15MM L-TAB T766
529702B02500G
BOARD LEVEL HEATSINK 1" TO-220
529801B02500G
HEATSINK TO-218 W/PINS 1.5"TALL
374024B00035G
HEATSINK BGA 23X23X10MM W/ADH
OMNI-UNI-30-75-D
HEATSINK TO-247 TO-264 TO-220
OMNI-UNI-18-50
HEATSINK 18X50MM TO-247 TO-264