APF19-19-10CB

SeriesAPF
PackageBox
Part StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Not Included)
ShapeSquare, Fins
Length0.748" (19.00mm)
Width0.748" (19.00mm)
Diameter-
Fin Height0.370" (9.40mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow5.30°C/W @ 200 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlack Anodized

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