APF30-30-06CB/A01

SeriesAPF
PackageBox
Part StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Included)
ShapeSquare, Fins
Length1.181" (30.00mm)
Width1.181" (30.00mm)
Diameter-
Fin Height0.250" (6.35mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow4.40°C/W @ 200 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlack Anodized

RELATED PRODUCT

ATS-55170D-C1-R0
HEAT SINK 17MM X 17MM X 9.5MM
C40-058-VE
HEATSINK FOR TO-247 TO-264
6400BG
BOARD LEVEL HEAT SINK
ATS-55190D-C1-R0
HEAT SINK 19MM X 19MM X 9.5MM
ATS-54270D-C1-R0
HEAT SINK 27MM X 27MM X 9.5MM
530002B02500G
HEATSINK TO-220 POWER W/PINS BK
532602B02500G
HEATSINK TO-220 SOLDERPIN 38.1MM
APF30-30-13CB/A01
HEATSINK FORGED W/ADHESIVE TAPE
375424B00034G
HEATSINK PIN-FIN W/TAPE
581102B02500G
HEATSINK TO-220 2.5W BLK W/PINS