APF19-19-13CB/A01

SeriesAPF
PackageBox
Part StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Included)
ShapeSquare, Fins
Length0.748" (19.00mm)
Width0.748" (19.00mm)
Diameter-
Fin Height0.500" (12.70mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow4.00°C/W @ 200 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlack Anodized

RELATED PRODUCT

518-95AB
HEATSINK DC/DC HALF BRICK VERT
902-21-2-12-2-B-0
HEATSINK 21X21X12MM PIN
APF19-19-06CB/A01
HEATSINK FORGED W/ADHESIVE TAPE
593002B03400G
HEATSINK TWISTED FIN TO-220
APF19-19-10CB/A01
HEATSINK FORGED W/ADHESIVE TAPE