SeriesPenguin
PackageBulk
Part StatusActive
TypeBoard Level
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Included)
ShapeSquare, Fins
Length0.650" (16.51mm)
Width0.653" (16.59mm)
Diameter-
Fin Height0.350" (8.89mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow8.00°C/W @ 500 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlack Anodized

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