Contact us [email protected]
BOM

53-77-10G

Series-
PackageBulk
Part StatusActive
Usage-
Type-
Shape-
Outline-
Thickness-
Material-
Adhesive-
Backing, Carrier-
Color-
Thermal Resistivity-
Thermal Conductivity-

RELATED PRODUCT

60-11-D397-T500
Parker Chomerics
60-11-D397-T500
CHO-THERM T500 TO-220 0.010"
60-11-D394-T500
Parker Chomerics
60-11-D394-T500
CHO-THERM T500 TO-220 0.010"
GP1500-0.125-02-15MMX15MM
Henkel / Bergquist
GP1500-0.125-02-15MMX15MM
GP1500 0.125 CUSTOM
60-11-D401-T441
Parker Chomerics
60-11-D401-T441
CHO-THERM T441 TO-247 0.008"
60-11-4659-T500
Parker Chomerics
60-11-4659-T500
CHO-THERM T500 DO-4 0.010"
60-11-5791-T500
Parker Chomerics
60-11-5791-T500
CHO-THERM T500 TO-220 0.010"
60-12-8302-T500
Parker Chomerics
60-12-8302-T500
CHO-THERM T500 TO-220 0.010" ADH
TG-A1250-100-100-0.5
t-Global Technology
TG-A1250-100-100-0.5
SILICONE THERMAL PAD 100X100X0.5
PC96-150-150-0.25
t-Global Technology
PC96-150-150-0.25
NON SILICONE 150X150X0.25MM
5590PI-O2
3M
5590PI-O2
THERM PAD 350MMX230MM BROWN

CONTACT INFO

Rm 1099,Block A,BaoHua Building,
     HuaQiang North Rd,Futian Dist, SZ, China.

[email protected]

INFORMATION

Products

Service

© Copyright LinkElectronics, All Rights Reserved

Payment Support Image